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Semiconductor

Global Trends in SiP Technology Development

February 26, 2016 / Hui-Chung, Tu

18 Page, Topical Report

US$1,600 (Single User License)

Abstract

Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

Table of Contents
1.Global Development of SIP Technology
1.1 High Levels of Integration and Miniaturization Drive SiP Development
1.2 SiP/Module Design Bundles for Diverse Development
1.3 Entry Barriers to SiP Remain High
2.Development of Global SiP Market Applications
2.1 Smartphones as Key Growth Driver for SiP
2.2 Mobile Devices, Wearables, and IoT Continue to Spur Demand for SiP
3.Development of the Global SiP industry
3.1 Packaging and Testing Service Providers Make Aggressive Move Towards SiP
3.2 IC Substrate Makers Also Extend Reach to SiP
3.3 Foundries Aim for Turnkey Services with SiP
4. Conclusion
4.1 Complete Supply Chain as Cornerstone of SiP Development
Appendix
Glossary of Terms
List of Companies

List of Topics
Development of SiP from the industry perspective and includes favorable and detrimental factors

Development of SiP from the perspective of market applications, touching on smartphones, other mobile devices, wearables and IoT

Development of SiP from the perspective of packaging and testing service providers, IC substrate manufacturers and foundries

List of Figures
Figure 1: How SiP Boosts Levels of Integration and Miniaturization
Figure 2: Major SiP Packaging Technologies
Figure 3: Use of SiP Modules in Smartphones
Figure 4: Global SiP Shipment Value and Growth, 2013-2016
Figure 5: Cooperation and Competition Between Foundries and Packaging and Testing Service Providers

Companies covered
Amkor, Apple, ASE, ChipPAC, Inotera Memories, JCET, Kansu, Nan Ya PCB, SPIL, TAM, TDK, Unimicron, USI

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