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Semiconductor

Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung, and TSMC

November 06, 2015 / Alex Yang

14 Page, Topical Report

US$1,800 (Single User License)

Abstract

The worldwide semiconductor foundry market has been growing steadily in recent years, thanks to the demand for smartphones, computers, wearables, and IoT (Internet of Things) application devices. Advanced processes have been the major driving force behind the growth. For this reason, IDMs such as Intel and Samsung have been deploying in 14nm and 10nm process technologies, thereby shaking the leadership of TSMC's market share. This report profiles the competition among Intel, Samsung, and TSMC—from the perspective of technology deployment, manufacturing capabilities, and customer relationship—and analyzes the future development of the semiconductor foundry market.

Table of Contents
1. Analysis of Advanced Process Technologies
1.1 Technology Roadmaps
1.1.1 Intel's Technology Leadership Had Little Impact on Pure-play Foundries
1.1.2 TSMC Dominates 20nm Process; Samsung Has a Head Start in 14nm Process
1.1.3 TSMC, Samsung Head-to-Head Competition for 10nm Process
1.2 Development of Key Technologies
1.2.1 Vendors Pursue 3D FinFET in Sub-2xnm Designs
1.2.2 TSMC Gets the Upper Hand over Samsung on 16/14nm Process
1.2.3 Samsung Faces More Challenges at 10nm Technology
1.2.4 Vendors All Focus on 3D IC Packaging Services
1.3 Capital Expenditures (Capex)
1.3.1 TSMC Concentrates on Advanced Process Investments

2. Analysis of Manufacturing Capabilities
2.1 Diversified Production Lines to Strengthen Competitiveness
2.1.1 TSMC Continues to Expand Market Share of Homogeneous ICs
2.1.2 Samsung, Intel Have a Head Start in Heterogeneous Integration
2.2 Smart Manufacturing to Create Economic Benefits
2.2.1 TSMC can Use Big Data Analytics to Widen its Advantage

3. Analysis of Customer Relationship
3.1 Samsung, Intel May Have Lower Customer Trust

Conclusion
Intel Strengthens Advanced Process Capacity by Acquisitions
Samsung Could Focus on Heterogeneous Integration
TSMC Needs to Reinforce Cooperation with Memory Vendors on 3D ICs
Appendix
Glossary of Terms
List of Companies

List of Topics
Analysis of the three companies' advanced process technologies, including their technology roadmaps, key technologies, pros and cons, and capital expenditures during 2011 and 2014

Overview of their manufacturing capabilities, touching on homogeneous integration, heterogeneous integration, and big data analytics applications on semiconductor fabrication

Profile of each company's customer relationship, comparing IDMs and pure-play foundries in terms of customer trust

List of Figures

Figure 1: Major Vendors' Advanced Technology Roadmap
Figure 2: Comparison of Major Vendors' Key Technologies
Figure 3: Comparison of Major Vendors' Packaging & Testing Technologies
Figure 4: Comparison of Major Vendors' Capex, 2011-2014
Figure 5: Product Lines of Major Vendors' Contract Manufacturing Services
Figure 6: Application of Big Data Analytics on Semiconductor Fabrication
Figure 7: Major Vendors' Position in the Semiconductor Industry Chain

Companies covered
Altera, Apple, Archronix, ESMT, Etron, IBM, Intel, MediaTek, NVIDIA, Qualcomm, Samsung, Spreadtrum, Tabula, Tsinghua Unigroup, TSMC, Xilinx

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