1. Trends in Worldwide and Taiwanese IC Packaging and Testing Industries
1.1 China's Market Share Sees Fastest Growth
1.2 Uncertain Market Growth for 2015
2. Future of Worldwide and Taiwanese IC Packaging and Testing Industries
2.1 Aggressive Expansion
2.2 SiP to Become Key Technology
2.3 Influence of IC Foundries' Development of High-end Heterogeneous Packaging Technologies
Conclusion 
Industry's Optimism about the Future on the Wane
Enhancement in Technology and Production Capacity as Key to Stay Ahead
Appendix
Glossary of Terms
List of Companies

Overview of the major trends in the worldwide and Taiwanese IC packaging and testing industries, including major vendors' rankings by revenue in 2014 and market share by region from 2012 to 2015. Also provided are shipment value forecasts of the worldwide and Taiwanese IC packaging and testing industries from 2015 to 2017

Highlights of the industry's future development, touching on vendors' capacity expansion activities from 2013 to present, growing demand for SiP technology due to wearable devices and IoT, and development of high-end heterogeneous packaging technologies
 

Figure 1: Worldwide Top 10 IC Packaging and Testing Vendors by Revenue, 2014
Figure 2: Worldwide IC Packaging and Testing Market Share by Region, 2012 - 2015
Figure 3: Worldwide and Taiwanese IC Packaging and Testing Industry Shipment Value, 2014 - 2017
Figure 4: Evolution of End-User Devices and Packaging Technologies
Figure 5: Leading IC Foundries' High-end Heterogeneous Packaging Technologies
 

Table 1: Worldwide and Taiwanese IC Packaging and Testing Vendor's Capacity Expansion, 2013 - 2015