MIC ENGLISH

Report Categories

ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Semiconductor

Taiwanese IC Packaging & Testing Industry, 3Q 2014

September 11, 2014 / Chung-Yu Yang

14 Page, Statistics Report

US$600 (Single User License)

Abstract

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry grew over 14% to stand at US$3.4 billion in the second quarter of 2014. A further uplift is expected in the third quarter to approximately US$3.5 billion.

List of Topics
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2012 - 4Q 2014 　
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2012 - 4Q 2014
Taiwanese IC Packaging Industry Shipment Value , 1Q 2012 - 4Q 2014 　
Taiwanese IC Testing Industry Shipment Value , 1Q 2012 - 4Q 2014 　
Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2012 - 2Q 2014 　
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2012 - 2Q 2014
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2012 - 2Q 2014 　
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2012 - 2Q 2014
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2012 - 2Q 2014 　
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 1Q 2012 - 2Q 2014
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 1Q 2012 - 2Q 2014
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 1Q 2012 - 2Q 2014
Exchange Rate, 4Q 2010 - 2Q 2014 　
Research Scope & Definitions

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

Recommended Research Reports

Consumer Brain-Computer Interface: Market and Product Development Trends (pre-order)
Coupang's Cross-border Pivot: Navigating Strategies in Taiwan Following Its Exit from Japan
Leading Mobile Payment Providers and Their Cross-Border Financial Services: Ant Group, Paysend, and Nium (pre-order)
Green Strategic Thinking of PC Brands From The Perspective of Product Lifecycle Stages (pre-order)
Product Development and Supply Chain Deployment of Leading Chinese Automotive Battery Supplier: CATL (pre-order)

To get MIC's complete insight, please log in.