Profiling the Smartphone high value-added components industry, comprising of components that are already supplied by Taiwanese manufacturers in the areas of small- and medium-sized panels, foundry service, and passive components and of components in the areas of application processor, baseband IC, integrated application processor/baseband IC solution, Bluetooth/Wi-Fi/GPS, NAND flash memory and Mobile DRAM where Taiwanese manufacturers' contribution still remains insignificant.
Companies and organizations analyzed or mentioned in the report include:Broadcom, Chimei Innolux, Elpida, Fujitsu, GlobalFoundries, Hitachi, HTC, Hynix, Icera, Inotera Technology, Intel, Kyocera Display, Lenovo, LG, LGD, Macronix, Mediatek, Micron, Motorola, Murata Manufacturing Co., Nanya Technology, NEC, NTT DoCoMo, Nvidia, Panasonic, Powerchip, ProMOS, Qualcomm, Renesas, Rexchip, Samsung, SEMCO, Sharp, SMD, Sony, Taiyo Yuden, Texas Instruments, TMD, Toshiba, TSMC, UMC, VIA Telecom, Winbond Electronics, Yageo