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More Leading Chipmakers Developing In-house Bluetooth SoCs for TWS Headsets
April 20, 2021


As Bluetooth technology advances and smartphone brands sequentially remove the 3.5-mm headphone jack from their phones, the TWS (True Wireless Stereo) headset market has continued to grow, according to MIC (Market Intelligence & Consulting Institute), a major government think tank and IT research institute in Taiwan. “Eying on the growth potential of TWS headsets, IC design houses have tapped into this market by in-house manufacturing their own SoCs (System on Chips), including Bluetooth SoC, for TWS headsets to improve end-market user experience,” said Angela Huang, industry analyst with MIC.

Application IC Suppliers for TWS Headsets


International Suppliers

Taiwanese Suppliers

Bluetooth SoC

Apple, Qualcomm, Huawei, Bestechnic (China), Actions (China)

Airoha Technology, Realtek, PixArt Imaging

Memory IC

GigaDevice (China), Adesto (U.S), Cypress Semiconductor (U.S.) etc.

Winbond, Macronix

Power management IC

TI, STMicroelectronics, NXP, Njoinic Technology, Etasolution (China), etc.


MCU, analog IC, MEMS microphone, and sensor

Will Semiconductor (China), SG Micro (China), AAC Technologies (Hong Kong), Goertek (China), etc.

Sitronix (sensor IC), Nuvoton (MCU), Holtek (MCU and touch controller IC), Tontek (touch controller IC), Zilltek (MEMS mics)

Note: x indicates the parameter has not yet disclosed

Source: Respective companies, compiled by MIC, April 2021

Based on MIC’s findings, more and more IC suppliers are extending their reach to TWS headsets by in-house developing Bluetooth SoCs (System on Chip). For instance, Qualcomm, Airoha Technology, and Bestechnic have launched their own Bluetooth SoCs to help reduce current consumption as there is generally a trade-off between current consumption and transmission power when using conventional Bluetooth SoCs.

To know more about this topic, please visit:  Development Trends of Application Chips for TWS Headsets (pre-order), The Taiwanese Fabless IC Industry, 1Q 2021, Taiwanese IC Packaging & Testing Industry, 1Q 2021, Leading Chipmakers’ Startup Investment Activity and Trends: Intel, Qualcomm, and Nvidia (pre-order), Taiwanese Semiconductor Manufacturing Industry, 1Q 2021

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