IC packaging service provider PTI (Powertech Technology Inc.) announced that it has reached a deal with Nepes to acquire NPL (Nepes Pte Ltd.), its 12-inch wafer bumping house in Singapore, reported the Central News Agency on April 29. With the acquisition of NPL, which has a monthly bump-wafer capacity of 12,000 to 13,000 units, PTI will be able to provide complete turnkey solution and strengthen its relationship with international semiconductor manufacturers. PTI reckons that the buildup of a wafer bumping line with a capacity level of 15,000 units by itself will cost around NT$1.5 billion (US$496.5 million; US$1 = NT$30.211). Yet, the financial terms of the deal is not disclosed.