SMIC (Semiconductor Manufacturing International Corporation) plans to launch mass production of 28nm technology at year-end 2014, with 20nm readiness in 2015, reported China' Securities Times on April 14. SMIC says 28nm to 45nm technology will be adopted by its second-phase expansion wafer fab in Beijing, which is slated for operation in September this year with a monthly capacity of 35,000 wafers. Aside from the Beijing fab, the company also has a fab under construction in Shenzhen, China. SMIC's 28nm technology can provide customers with MPW (Multi Project Wafer) services, including 28nm PS (PolySiON) and 28nm HKMG (High-K Dielectrics Metal Gate) processes, mainly applied to processors and chips for smartphones, tablets, and set-top boxes.