UMC (United Microelectronics Corp.) announced on June 13 that the company will participate in IBM Technology Development Alliance to jointly develop 10nm CMOS (Complementary Metal-Oxide Semiconductor) process technology, according to UMC's press release. The alliance was formed by IBM more than a decade ago with the aim of co-developing chip technology with partners' shared investment and brainpower. With IBM's support, UMC expects to continuously improve its internally developed 14nm FinFET (Fin Field-Effect Transistor) process technology and provide low-power chips for mobile computing and communications applications in a timely manner. UMC will cooperate on the development of baseline 10nm process technology in the United States while the implementation of 14nm FinFET and 10nm will be carried out at UMC's R&D center in Tainan, Taiwan.