Asia Express - East Asian ICT
Elpida, Powertech, UMC Team up for 3D IC Integration Technologies
June 03, 2011

Elpida, Powertech, and UMC announced the collaboration on 3D IC integration technologies for advanced manufacturing processes, according to a May 31, 2011 report by EE Times. It is reported that the collaboration concentrates on TSV (Through-Silicon Via) technology to set up a reliable approach to logic-plus-DRAM (Dynamic Random Access Memory). The collaboration among the three companies includes logic-to-DRAM interface design, TSV formation, wafer thinning, testing, and chip-stacking assembly. It is projected that the resulting technology will be able to cut costs, enhance logic yields, and accelerate 3D IC market entry.