Intel to Boost Work Force at Chengdu IC Packaging Base
May 29, 2010
Intel plans to expand the work force at its IC
packaging plants in Chengdu, China, EE Times reported on May 26. Inaugurated in
2005, Intel's Chengdu base currently has two plants; one provides
microprocessor IC packaging services, and the other engages in IC packaging for
chipsets. The present headcount stands at around 2,500, and Intel expects to
boost the number to 3,000 by year-end 2010. It is projected that Intel's
Chengdu base will eventually have four plants with a total floor space of
600,000 square feet as well as two separate buildings for general purposes.
Equipment upgrade is currently underway at the Chengdu plants.