Asia Express - East Asian ICT
Elpida Outsources DRAM Production to ProMOS, Winbond
November 15, 2009
Japan's Elpida Memory has inked DRAM (Dynamic Random Access Memory) foundry deals with Taiwan's ProMOS Technologies and Winbond Electronics, Nikkei reported. Elpida is expected to transfer advanced DRAM process and product technologies to ProMOS in exchange for manufacturing capacity at ProMOS's Taichung 300mm wafer fab. The capacity will be utilized for the production of Elpida's 1Gb DDR3 (Double Data Rate 3) device. Completion of production trials is slated for the first half of 2010 and mass production for the second half of the same year.

As for the foundry collaboration with Winbond, the two companies have signed a memorandum of understanding for Winbond to supply GDDR3 (Graphics DDR3) and GDDR5 DRAMs to Elpida. The two companies have teamed up for the commercialization of said products prior to the present agreement, and Winbond expects to begin commercial production by year-end 2009. Beginning in the first half of 2010, Elpida is scheduled to purchase the output provided by Winbond and sell the products under Elpida's corporate brand name.