IBM-Toshiba Cooperation to Include 32nm CMOS Process Technology
December 21, 2007
As a continuation of their ongoing cooperation on the development of 32nm chipmaking technology, as reported in Asia Express dated January 20, 2006, IBM and Toshiba announced on December 18 that they will expand their partnership to include 32nm bulk CMOS (Complementary Metal-Oxide-Semiconductor) process technology.
Pursuant to the new agreement, Toshiba will team up with the IBM CMOS alliance - currently comprising six members, including AMD, Chartered Semiconductor, Freescale, Infineon, and Samsung - on developing 32nm bulk CMOS process technology at the premises in East Fishkill, New York, according to a press release by IBM.
Starting in December 2005, IBM and Toshiba's joint research on 32nm semiconductor process technologies has been conducted at the facilities in Yorktown and Albany, New York, according to a Nikkei news report.