TSMC announced the formation of a new Open Innovation Platform (OIP) 3DFabric Alliance on October 26, with an aim to help customers achieve efficient implementation of silicon and system-level innovations and enable next-generation HPC and mobile applications using TSMC's 3DFabric technologies, according to TSMC's press release on October 28. 3DFabric technologies has a comprehensive family of 3D silicon stacking and advanced packaging technologies to unveil a new era of chip- and system-level innovation. Marking the first of its kind in the semiconductor industry, this new alliance is the sixth alliance of the TSMC OIP, which already consists the EDA Alliance, IP Alliance, Design Center Alliance (DCA), Value Chain Alliance (VCA), and Cloud Alliance. By joining the new Alliance, TSMC's customers have early access to 3DFabric technologies with early availability of solutions and services from EDA and IP to DCA/VCA, memory, OSAT (Outsourced Semiconductor Assembly and Test), substrate, and testing partners. Partners currently include Advantest, Alchip, Alphawave, Amkor, Ansys, Arm, ASE Group, Cadence, GUC (Global Unichip Corp.), Ibiden, Micron, Samsung, Siemens, SPIL, SK Hynix, Synopsys, Teradyne, and Unimicron.
In spite of somewhat unfavorable global uncertainties, the Taiwanese semiconductor industry is to continue growth in 2023 albeit at a much slower rate, according to MIC (Market Intelligence & Consulting Institute). MIC estimates the industry's shipment value will still grow at 7% year-on-year and reach NT$4.37 trillion (US$138.3 billion) in 2023, NT$2.5 trillion (US$79.1 billion; US$1=NT$31.6) or 57% of which will be contributed by foundries. Established in 1987, MIC is a division of III (Institute for Information Industry), a major government think tank, and one of the leading IT research institutes in Taiwan.