Asia Express - East Asian ICT
Taiwan's UMC Joins Hands with Japan's Denso for Automotive Power Semiconductors
May 13, 2022

Leading Taiwanese foundry UMC recently announced that the company has collaborated with Denso through its subsidiary USJC on the production automotive power semiconductors, according to UMC's press release. Under the tie-up, UMC will implement USJC's 300mm wafer manufacturing technology into the mass production of 300mm IGBTs (Insulated Gate Bipolar Transistors) while Denso will offer its system-oriented IGBT device and process technologies. The mass production of IGBTs on 300mm wafers is set to begin in the first half of 2023. IGBTs are essential in power cards, which help drive and control electric vehicle motors. The cooperation aims to tap the rapidly increasing demand for semiconductors required by electric vehicles and electrification of vehicles. Japan's Ministry of Economy, Trade, and Industry has provided financial and policy support for the collaboration.
Shipment value of the Taiwanese semiconductor industry scored US$36.1 billion in the fourth quarter of 2021, up 1.7% sequentially and 30.5% year-on-year, according to MIC (Market Intelligence & Consulting Institute), one of leading IT research institutes in Taiwan, and a division of the III (Institute for Information Industry). By subindustry, shipment value of the Taiwanese semiconductor manufacturing subindustry, comprising of foundry and memory sectors, reached US$19.4 billion in the fourth quarter of 2021, up 4.9 sequentially and 27.5% year-on-year.