Micron Technology recently announced that it will invest the next-generation EUV (Extreme Ultraviolet Lithography) equipment to reinforce the development of next-generation DRAMs in Taiwan by 2024, the Commercial Daily reported on October 22. Pursuant to the plan, the company will install ASML’s EUV equipment to its fabs based in Taiwan in order to produce EUV DRAMs by 2024. Micron announced earlier this year that the company’s facility investment will increase from US$9 billion last year to US$9.5 billion this year, mainly owing to EUV investment. For TSMC, chips fabricated using EUV lithography-based 7nm and more advanced processes have accounted for 49% of the company’s sales. Another competitor Nanya Technology also plans to spend NT$300 billion (US$10.9 billion) for a new EUV DRAM plant, which is slated for operations in 2024. Global semiconductor market value is expected to reach US$550.9 billion while shipment value of the Taiwanese semiconductor is estimated at U$S130.8 billion in 2021, respectively representing a year-on-year growth of 25.1% and 31.8%, according to MIC (Market Intelligence & Consulting Institute), a major government think tank and a leading IT research institute in Taiwan. MIC stated that the industry’s growth in 2021 is  mainly attributed to the significant quarterly increase in DRAM and Flash contract prices.