Asia Express - Computing
AMD Shakes Hands with TSMC to Create Innovate Production Line
June 14, 2019

AMD (Advanced Micro Devices, Inc.), a global processor manufacturer, celebrates its 50th anniversary this year. Through deep cooperation with the OEM leader TSMC (Taiwan Semiconductor Manufacturing Co. Ltd.), in the second half of the year, under the new-generation 7-nm production line, AMD will launch the third generation Ryzen processor, the second generation EPYC server processor, the new generation Navi graphics chip and the Radeon graphics card.

Dr. Lisa Su, CEO and President of AMD, says 2019 will continue to be a year of super success and we will also launch the most extensive and competitive product portfolio ever. Dr. Su indicates that AMD has made an exciting start in 2019, celebrating the 50-year innovation process by launching a number of leading products, and continuing to open up new frontiers of computing and graphic technology.

In the new-generation Zen 2 core, breakthrough chiplet design and advanced process technology, AMD focuses on large-scale strategic investment to build a 7-nanometer production line, that leads the industry and builds a high-performance computing industry system.

The core of the AMD Zen 2 processor is developed through a revolutionary modular design approach. This modular system design uses an enhanced version of AMD Infinity Fabric interconnect technology to connect individual Chiplets in a single processor package. The Zen 2 core of this multi-chip processor uses TSMC's 7nm process, and can also use the mature 14/12nm process technology to create I/O chips, which can greatly improve performance and embed more Zen 2 at the same power consumption. The core is to achieve a more cost-effective manufacturing model than traditional SoC designs. The modular design method of AMD Chiplet system package, combined with TSMC's 7nm advanced process technology, brings significant improvements in performance, power consumption and density for the Zen 2 core. AMD has also begun to invest in Zen 3 core research and development, in addition to the continued use of Chiplet packaging technology, it is also expected to introduce TSMC to support the extreme ultraviolet (EUV) 7+ nanometer process, as for the future Zen 4 core is expected to use TSMC 5 nanometer process production.