Asia Express - East Asian ICT
TSMC Launches New Cloud-based Open Innovation Platform with Microsoft, Amazon, and Other Partners
October 05, 2018

TSMC recently announced that it has initiated the OIP VDE (Open Innovation Platform Virtual Design Environment) and established the OIP Cloud Alliance, with an aim to provide a highly efficient and safe chip design environment for the semiconductor industry and lower barriers for ecosystem partners who are driving cloud adoption, the CNA News reported on October 4. By combining with its existing OIP and the dedicated platforms of its partners such as Amazon Web Services, Cadence, Microsoft Azure, and Synopsys, TSMC's OIP VDE has been able to provide a complete SoC (System-on-Chip) design environment in the cloud for its OIP ecosystem partners. On top of that, TSMC also established the OIP Cloud Alliance, consisting of five alliances so far, namely the EDA Alliance, IP Alliance, Design Center Alliance, Value Chain Aggregator Alliance, and the Cloud Alliance.