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Asia Express - East Asian ICT
A
Global Semiconductor Packaging Materials Market to Register US$20.8 Billion by 2024
July 30, 2020
A
Huawei to Lay Off 60% to 70% of Workforce in India
July 29, 2020
A
Zing Semiconductor Aims to Churn Out 100,000 12-inch Wafers Monthly by End of 2018
July 27, 2018
A
Xilinx Acquires DeePhi Technology to Deepen Presence in Machine Learning
July 20, 2018
A
MIC to Celebrate 30th MIC Forum for the Whole Month of September and Sponsor 5G Summit in Taipei
July 28, 2017
A
HTC Moves Forward its VR Business with Apple and Google
July 21, 2017
A
Taiwan to Kick-start Five-year AI Initiative for Over USD160 Million
July 15, 2017
A
Samsung Embarks on New NAND Chip Plant Construction in Pyeongtaek
July 06, 2017
A
Lenovo, JD.com Expand Cooperation to Boost Sales in China
July 29, 2016
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Tsinghua Unigroup, XMC Team Up for China's NAND Flash Industry
July 28, 2016
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