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Asia Express - East Asian ICT
A
Intel to Boost Work Force at Chengdu IC Packaging Base
May 29, 2010 / Asia Express
A
Qualcomm Inaugurates New R&D Center in Shanghai
May 28, 2010 / Asia Express
A
Shanghai Huali, IMEC China to Collaborate on 65nm CMOS Process
May 28, 2010 / Asia Express
A
Samsung Earmarks US$15 Bln Capex for 2010
May 22, 2010 / Asia Express
A
TSMC Approves US$1.65 Bln Spending on Capacity Expansion, New Fab
May 22, 2010 / Asia Express
A
China Vows to Complete Telecom/Broadcast/Internet Convergence in Next Three to Five Years
May 19, 2010 / Asia Express
A
Toshiba to Boost Three-year Capex, Build Fifth Memory Plant in Yokkaichi
May 14, 2010 / Asia Express
A
Samsung Unveils New NAND Memory Chip for Smartphones; Inaugurates Quality Assurance Lab in Tianjin
May 07, 2010 / Asia Express
A
TSMC to Build Third 300mm Wafer Fab in Central Taiwan
May 01, 2010 / Asia Express
A
Samsung, SanDisk Reach New Patent Cross-license Deal
May 27, 2009 / Asia Express
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