MIC ENGLISH

Report Categories

ALL China Research Communications Computing Semiconductor Software and Consumer Electronics TAIWAN

Semiconductor

Taiwanese IC Packaging & Testing Industry, 3Q 2017

October 26, 2017 / Charles Chou

15 Page, Statistics Report

US$600 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry enjoyed 10% year-on-year and nearly 8% sequential growth in the second quarter of 2017, to nearly USD 3.5 billion. The growth in the second quarter was attributed mainly to the strong shipment value from the IC testing industry. The upward growth trend is anticipated to have continued into the third quarter of 2017, with a shipment value of over USD3.5 billion.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2015 - 4Q 2017
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2015 - 4Q 2017
Taiwanese IC Packaging Industry Shipment Value , 1Q 2015 - 4Q 2017
Taiwanese IC Testing Industry Shipment Value , 1Q 2015 - 4Q 2017
Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2015 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2015 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2015 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 1Q 2015 - 2Q 2017
Exchange Rate, 1Q 2015 - 2Q 2017
Research Scope & Definitions

List of Topics
This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton

Recommended Research Reports

Consumer Brain-Computer Interface: Market and Product Development Trends (pre-order)
Coupang's Cross-border Pivot: Navigating Strategies in Taiwan Following Its Exit from Japan
Leading Mobile Payment Providers and Their Cross-Border Financial Services: Ant Group, Paysend, and Nium (pre-order)
Green Strategic Thinking of PC Brands From The Perspective of Product Lifecycle Stages (pre-order)
Product Development and Supply Chain Deployment of Leading Chinese Automotive Battery Supplier: CATL (pre-order)

To get MIC's complete insight, please log in.