Semiconductor
Taiwanese IC Packaging & Testing Industry, 1Q 2020
June 03, 2020 / Angela Huang
18 Page, Statistics Report
US$1,000 (Single User License)

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.33 billion in the fourth of 2019, up 4.3% sequentially and 10.6% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications and products become major growth drivers to bolster the demand for high-end wafer-level packaging service. Shipment value of the industry is expected to have grown 18.8% year-on-year but declined 7.5% sequentially, reaching USD4.0 billion in the first quarter of 2020. The decline is mainly attributed to the seasonal cycle of the industry and the reduced working days due to COVID-19 pandemic.
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