Taiwan-based Wafer Technology recently announced that it is going to expand capacity of its fabs in Taiwan and China both this and next year, Economic Daily News reported on August 18. To tap the increasing demand for auto electronics ICs, microcontrollers, and CMOS sensors, Wafer Technology plans to expand capacity of its 6" fab in Yangmei (Taiwan) from 300,000 to 360,000 units and its 8" fab in Longtan (Taiwan) from 20,000 to 30,000 units. Kicked off operations at the end of July, it new fab in Zhengzhou (China) is set to begin mass production in 2018. In the first phase, the Zhenzhou fab aims to produce 200,000 8" wafers per month by 2019 and increase further to 300,000 units. In addition, the company aims to venture into 12" wafer production in the second phase with a monthly capacity of over 200,000 units. Ultimately, this will help the company carve its way from sixth to fourth place in the global wafer market within the next five years.